What material film should be used for semiconductor electronic product packaging

The materialfilm used for semiconductor electronic product packaging should have certaincharacteristics such as high purity, excellent barrier properties, andresistance to chemicals and moisture. Some commonly used materials forsemiconductor packaging films are:

1.Polyethyleneterephthalate (PET): This is a widely used packaging material due to itsexcellent mechanical and barrier properties, as well as its low permeability tomoisture and gases.

2.Polyimide (PI):PI films are known for their high-temperature stability, chemical resistance,and excellent electrical insulation properties, making them suitable for use inelectronic applications.